Well I got most of the ICs onto the board. THe first three are fine-pitch (0.5 mm between pads). They were difficult to hand solder. The best approach seems to be the “drag solder” method, where you pull some excess solder across a whole row of pads, then use solder wick to remove any shorts.
The remainder of the assembly should be easy, it will just be a matter of finding the time. Building circuits is not the highest priority in the Summer time.